EXTreme Ten60Power™

EXTreme Ten60Power™

A 60 Amp modular high power and signal combo connector system for coplanar and right-angle board-to-board applications. Designed as a high-current and lower profile interconnect than existing connectors, EXTreme Ten60Power™ interconnects provide maximum current-to-length ratio packaged in a low 10 mm height housing that enhances airflow within the system.

FEATURES

  • Performance up to 60 A per power blade
  • Rugged 10 mm low profile design (right-angle orientation)
  • 3 or 5 signal rows in the same form factor
  • Available with 0 to 40 signal pins
  • Up to 20 total DC power blades or 12 total AC power blades
  • AC-DC power combos and split power options available
  • Press-fit tails option for ease of board termination (ET60S only)
  • Modules can be configured to accommodate most any design
  • For coplanar or perpendicular applications
  • Hot plug option available
  • Dual sourced by Molex®

SERIES

ET60S

.100" EXTreme Ten60Power™ 60 Amp Signal/Power Combo Socket Strip

Features
  • 60 A per power blade
  • Vertical and right-angle orientations
  • 3 or 5 signal rows in the same form factor
  • 0 to 40 total signal pins
  • Up to 20 total DC power blades or 12 total AC power blades
  • AC-DC power combos and split power options available
  • Rugged low profile design
  • Optional press fit tails
  • Dual sourced by Molex®
.100" EXTreme Ten60Power™ 60 Amp Signal/Power Combo Socket Strip

ET60T

.100" EXTreme Ten60Power™ 60 Amp Signal/Power Combo Terminal Strip

Features
  • 60 A per power blade
  • 10.00 mm low profile design (right-angle)
  • 3 or 5 signal rows in the same form factor
  • 0 to 40 total signal pins
  • Up to 20 total DC power blades or 12 total AC power blades
  • AC-DC power combos and split power options available
  • Right-angle
  • Dual sourced by Molex®
.100" EXTreme Ten60Power™ 60 Amp Signal/Power Combo Terminal Strip

One of the biggest events in the FPGA/SoC ecosystem is the annual Xilinx Developers Forum (XDF). XDF connects software developers and system designers to the deep expertise of Xilinx engineers, partners, and industry leaders. XDF takes place in three locations this year.  Samtec ...
Samtec performs several tests in-house as part of our qualification testing on a product series; including Low Level Contact Resistance (LLCR). It measures the amount of resistance in a position on a part. LLCR is used in combination with several other tests to track the overall ...
Makers of Louisville and Southern Indiana – Assemble! Obviously, the Samtec blog team has been watching too many superhero and Ron Burgundy movies.  However, the point still remains that this weekend marks a busy schedule for the maker community in the Kentuckiana area. Count’em....
In August we rolled out several updates with our continued support of industry standards, updated our homepage to feature Silicon-to-Silicon content and made a highly requested update to our product detail pages to show pricing and distributor stock. Here are the major updates to...
One Up Studio is a hardware design engineering provider with a focus on signal integrity, and not coincidentally, a Samtec customer. I caught up with Paul Monar, the owner, to pick his brain about some interesting design challenges he faces at One Up and his connector system sele...
View Full Site