High-Speed Backplane Systems

High-speed, high-density backplane systems include ExaMAX® and XCede® HD in a variety of pair and column counts. ExaMAX® enables to 56 Gbps performance and allows designers the option to optimize density or minimize board layer count. XCede® HD is a small form factor system with a modular design for significant space savings and flexibility.


XCede® HDXCede® HD High-Density Backplane Connector System

Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions.

Features
  • Small form factor provides significant space savings
  • Modular design provides flexibility in applications
  • High-performance system
  • High-density backplane system – up to 84 differential pairs per linear inch
  • 1.80 mm column pitch
  • 3-, 4- and 6-pair designs
  • 4, 6 or 8 columns
  • 12 - 48 pairs
  • Multiple signal/ground pin staging options
  • Integrated power, guidance, keying and side walls available
  • 85 Ω and 100 Ω options
  • Three levels of sequencing enable hot plugging
  • Cost-effective designs available for low-speed applications
Series
V
  • HDTF
  • HDTM
  • HPTS
XCede® HD

ExaMAX®ExaMAX® High-Speed Backplane Connector System

ExaMAX® high-speed backplane interconnects deliver 56 Gbps electrical performance.

Features
  • Enables 56 Gbps electrical performance on 2.00 mm column pitch
  • Allows designers to optimize density or minimize board layer count
  • Two reliable points of contact, even when subjected to angled mating
  • Meets Telcordia GR-1217 CORE specification
  • Individual signal wafers with staggered differential pair design; 72 or 40 pairs
  • One-piece embossed ground structure on each signal wafer to reduce crosstalk
  • Lowest mating force on the market: 0.36 N max per contact
  • Stub free mating
  • Press fit termination
  • Power and Guide Modules available
Series
V
  • EBTM
  • EBTF-RA
  • EGBF
  • EGBM
  • EPTT
  • EPTS
  • EBDM-RA
ExaMAX®

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