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Mid-Board + Panel Optics System Optimization

Samtec’s optical and signal integrity expertise enables systems designed to ensure maximum density, cost and performance optimization, while offering an easy path to 56 Gbps and beyond.

SAMTEC OPTICAL GROUP

Advanced design, development and application support.

High-performance micro optical engine design + manufacturing

High-performance micro optical engine design + manufacturing

Integration of advanced products with patented technologies

Integration of advanced products with patented technologies

Application-specific solutions for high-performance systems

Application-specific solutions for high-performance systems

Active optical assemblies + high-density ganged passive systems

Active optical assemblies + high-density ganged passive systems

ADVANCED INTERCONNECT DESIGN

Future-proof designs for today’s data rates and beyond.

Future-proof connector designs offer easy migration path to 56+ Gbps

Future-proof connector designs offer easy migration path to 56+ Gbps

Innovative solutions for optical applications

Innovative solutions for optical applications

Support for industry-standard optical systems

Support for industry-standard optical systems

Full system Signal / Power Integrity analysis and design

Full system Signal / Power Integrity analysis and design

PRACTICAL APPLICATIONS

Integrated Technology Centers provide unprecedented support for high-performance systems.

OPTICAL SOLUTIONS FOR HIGH-PERFORMANCE MID-BOARD SYSTEMS

TechWaY TigerFMC
TechWaY TigerFMC, a VITA 57.1 compliant mezzanine card integrates Samtec’s FireFly™ with 10 full duplex, 10 Gbps optical links, for 200 Gbps aggregate bandwidth.

Samtec provides full channel support for growing demands for increased bandwidth, performance and density, via the expertise of our Optical and Signal Integrity Groups and Samtec Teraspeed Consulting, including:

  • In-house optics design, engineering and application expertise and support
  • Full channel and electrical-to-optical simulation,signal integrity and connectivity analysis
  • High-speed routing and layout assistance,including breakout region recommendations to streamline the design process
  • Extensive test and measurement capabilities
  • Power delivery / power integrity expertise
  • Assistance from consulting review to full turn-key design

Contact firefly@samtec.com to discuss your specific application.

OPTICAL SOLUTIONS FOR ADVANCED + EMBEDDED SYSTEMS

Samtec’s FireFly™ optical micro flyover system is a robust solution for the high data rate demands of silicon development, high-performance computing, simulation and emulation applications. Benefits include:

  • Simplified design and board routing at data rates up to 28Gbps
  • A micro footprint ideal for small form factor and densely populated applications

Samtec also offers co-development and co-marketing opportunities for high data rate systems. FireFly™ x12 simplex and duplex systems and x4 duplex systems have recently been used:

  • As a mid-board optics flyover solution
  • As a fast-path I/O via MTP® to go outside of the box
  • To create embedded optics for rugged environments
  • As a flyover optical backplane incorporating a standard VITA 66.4 interconnect solution

Contact sig@samtec.com to discuss your high-performance application needs.

Samtec Optical Group and Samtec Teraspeed Consulting
Samtec Optical Group and Samtec Teraspeed Consulting collaboration with Guzik on Guzik’s Fiber Optics-to-PCIe® Bridge Card incorporates Samtec’s FireFly™ technology, which enables evolving markets to take advantage of the latest optical technology.

FIREFLY™ EVALUATION KITS

FIREFLY™ EVALUATION KITS

Samtec offers evaluation kits rated up to 28 Gbps, that allow designers real-time evaluation of an actively running FireFly™ system — in your lab, with your inputs.

For additional information contact FireFly@samtec.com.

MID-BOARD + PANEL OPTICS

Samtec Optical Group provides complete design, engineering and application support for high-performance optical engines, active optical assemblies and high-density ganged passive optical panel solutions. Contact firefly@samtec.com for additional details.

MID-BOARD ACTIVE OPTICAL FLYOVERS

  • FireFly™ future-proof high-performance micro flyovers
  • x4 and x12 simplex or duplex transceiver systems
  • 14 Gbps and 28 Gbps(in development) per channel
  • Extended temperature system (-40ºC to + 85ºC)
  • Rugged, easy on-board interconnects
  • Variety of standard integrated heat sinks

PCIe® ACTIVE OPTICAL CABLE

  • Gen3 x8, Gen3 x4 and x4 / x8 conversion cables
  • Full AOCs and pigtailed cables
  • Distances up to 100 meters

PASSIVE OPTICAL MICRO BACKPLANE

  • Ganged MT ferrule optical couplers
  • Panel and backplane half AOC terminations to any industry standard passive interface
  • MT / MTP® / LC / MXC passive terminations
  • Optical patch cable and adaptor system
POG215-G Active optics-2b
PCI Express® Pin-Fin Heat Sink
Fiber Grooved Heat Sink
Firefly™ Flat Heat Sink
ECUO Series UEC5/UCC8 Series PCIEO Series
FireFly™ Micro Flyover FireFly™ Micro Flyover PCIe®
OM3 Optical Fiber Two-piece interconnect system OM2 or OM3 Optical Fiber
0.50 mm pitch UEC5: 0.50 mm pitch
UCC8: 0.80 mm pitch
0.80 mm pitch
28 Gbps 28 Gbps 8 GT/s
Mates: UEC5/UCC8 Mates: ECUO Mates: PCIEA
ECUE Firefly™ Explode

PATENTED OPTICAL ENGINE TECHNOLOGY

  • 850 nm VCSEL / PIN technology
    • Standard compatible with Ethernet, InfiniBand™ and Fibre Channel
    • Integrated AC coupling capacitors
    • Industry standard two-wire interface
    • Class 1 laser output
  • x12 simplex or duplex transceiver systems
  • x4 simplex and duplex systems also available
  • 14 Gbps and 28 Gbps(in development)
  • Last step fiber and heat sink attach
    • Convective and conductive heat sink options
    • Variety of optical terminations
    • Custom heat sink and fiber pigtail possible
  • FireFly™ qualification criteria: Telcordia GR-468
High-Performance Micro Engine

For additional information, please contact firefly@samtec.com or visit samtec.com/optics.

TECHNOLOGY ROADMAP MID-BOARD + PANEL OPTICS

Advanced IC Packaging

28+ Gbps x12 simplex optical FireFly™

Custom Packages + Substrates

14 & 28+ Gbps x4 duplex optical FireFly™

Fine Pitch Wirebond

x4 duplex system for -40 ºC to +85 ºC

Stacked Die, MCM, Customs

16 Gbps simplex optical FireFly™

Finishing: Dam to Seal

FireFly™ with PCI Express® Interoperability

High-Density Flip Chip

Ganged panel and backplane MXC optical connectors for 35% more space savings

Micro Wirebond

Robust latch and pluggable connector (in development)

Transferd Mold

Silicon Photonics Single Mode (in development)

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