Solutions & Support for Next Gen System Demands


As data rate requirements approach and surpass 56 Gbps, developers are challenged with balancing increasing throughput, scalability and density demands with concerns such as power consumption, signal integrity, cost and time-to-market. Samtec helps address these challenges with industry-leading expertise in high-performance interconnect design, system optimization, and innovative strategies and technologies for the demands of next generation data transmission.


High-Speed
Interconnect
Expertise


High-Performance
SI Characterization
Testing & Validation


online
design tools
& resources

samtec technology centers

High-Performance System Design & Support from Silicon-to-Silicon™


SIGNAL INTEGRITY GROUP AND SAMTEC TERASPEED CONSULTING

Full channel signal and power integrity analysis, testing and validation services
sig@samtec.com

SAMTEC OPTICAL GROUP

R&D, design, development and support of micro optical engines and assemblies
optics@samtec.com

Advanced
Interconnect Design

High precision stamping, plating, molding and automated assembly
asg@samtec.com

Samtec microelectronics group

Glass Core Technology (GCT), next gen 2.5D / 3D solutions, advanced IC packaging and assembly
sme@samtec.com

HIGH–SPEED CABLE GROUP

In-house R&D and manufacturing of precision extruded cable and assemblies
hdr@samtec.com

PRECISION RF GROUP

RF interconnect design and development expertise, with testing to 65 GHz
rftechnicalgroup@samtec.com

Characterization & development

Samtec Development Boards and SI Characterization Kits help simplify the design process and reduce time to market. Kits are available for many of our high-performance connector sets and standard high-speed cable assembly configurations; customized kits are also available for application specific evaluation.


Samtec SI Characterization Kits are currently available for the following products; additional kits are also in development. Contact kitsandboards@samtec.com for the most current list, or to discuss your evaluation requirements.

  • ExaMAX® High-Speed Backplane Connectors
  • Flyover™ QSFP28 Double-Density
  • Flyover™ QSFP28
  • AcceleRate® Cable
  • NovaRay™ Extreme Density Arrays
  • High-Speed Micro Edge Card Connectors
  • LP Array™ Low-Profile Arrays
  • Z-Ray® Low-Profile Interposers

Visit samtec.com/kits for more information.

One of the biggest events in the FPGA/SoC ecosystem is the annual Xilinx Developers Forum (XDF). XDF connects software developers and system designers to the deep expertise of Xilinx engineers, partners, and industry leaders. XDF takes place in three locations this year.  Samtec ...
Samtec performs several tests in-house as part of our qualification testing on a product series; including Low Level Contact Resistance (LLCR). It measures the amount of resistance in a position on a part. LLCR is used in combination with several other tests to track the overall ...
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In August we rolled out several updates with our continued support of industry standards, updated our homepage to feature Silicon-to-Silicon content and made a highly requested update to our product detail pages to show pricing and distributor stock. Here are the major updates to...
One Up Studio is a hardware design engineering provider with a focus on signal integrity, and not coincidentally, a Samtec customer. I caught up with Paul Monar, the owner, to pick his brain about some interesting design challenges he faces at One Up and his connector system sele...
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