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System Optimization

Silicon-to-Silicon™ System Optimization capabilities assist designers in optimizing the high-speed serial path from bare die, to IC package and assembly, to PCB, to connectors and cable assemblies, and back again. These capabilities include:

  • Assisting IC layout designers to optimize power and signal integrity of the bare die during the IC design process
  • Developing complex, customized IC packaging and assembly solutions enabling maximum IC density, precision and ruggedness
  • Enabling PCB designers to create denser, faster PCBs by providing factory and field-based technical support to ensure signal chain optimization
  • Providing the products, tools, design expertise and consulting services to link high-speed signal chains between PCBs and through backplanes
  • Engineer industry standard and customized copper and optical cable assemblies at data rates up to 28Gbps and beyond
  • IC Packaging
  • Advanced package design and assembly capabilities along with the ability to assist in choosing the best technology and materials for an application, helping to save valuable design and engineering time.

    Go to IC Packaging

  • Mid-Board & Panel Optics
  • Patented signal integrity-optimized optical systems designed to ensure maximum density at minimum cost, while offering a path to 56 Gbps.

    Go to Mid-Board
    + Panel Optics

  • High-Speed Backplane
  • High-performance backplane systems designed to optimize density and minimize board layer count, while offering an easy migration path to 56 Gbps performance.

    Go to High-Speed
    Backplane

  • Twinax Flyover
  • Ultra high-performance cable systems engineered to extend signal reach and performance by routing high-speed signals via ultra low skew twinax cable rather than through the PCB.

    Go to Twinax Flyover

  • High-Speed Mezzanine
  • High-density, low profile systems designed to optimize signal integrity in high-performance board-to-board, IC-to-board and cable-to-board applications.

    Go to High-Speed
    Mezzanine

IC Packaging

Advanced package design and assembly capabilities along with the ability to assist in choosing the best technology and materials for an application, helping to save valuable design and engineering time.

Go to IC Packaging



Mid-Board & Panel Optics

Patented signal integrity-optimized optical systems designed to ensure maximum density at minimum cost, while offering a path to 56 Gbps.

Go to Mid-Board
+ Panel Optics



High-Speed Backplane

High-performance backplane systems designed to optimize density and minimize board layer count, while offering an easy migration path to 56 Gbps performance.

Go to High-Speed
Backplane



Twinax Flyover

Ultra high-performance cable systems engineered to extend signal reach and performance by routing high-speed signals via ultra low skew twinax cable rather than through the PCB.

Go to Twinax Flyover



High-Speed Mezzanine

High-density, low profile systems designed to optimize signal integrity in high-performance board-to-board, IC-to-board and cable-to-board applications.

Go to High-Speed
Mezzanine

It’s been over a year since we last updated the Samtec homepage. As you may have already noticed, we recently took some time to refresh it. You can see a comparison below of the old homepage (top), vs the new homepage (bottom). The new update puts more attention on our high speed...
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Demand For High Data Rate As the need for bandwidth continues to increase, so does the need for higher data rates within a system. What was once one to three Gbps, then moved to 4 to 8 Gbps, and now we are approaching 28 Gbps and looking forward to 56 G. This trend was recently [...
Samtec is pleased to announce the new Silicon-to-Silicon Application Solutions Guide. This updated guide details the evolution of Samtec technologies, products and technical support available for next-gen system data rates. 56 Gbps PAM4. 56 Gbps NRZ. 112 Gbps PAM4. Whatever the d...
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