High-speed, high-density backplane systems include ExaMAX® and XCede® HD in a variety of pair and column counts. ExaMAX® enables to 56 Gbps performance and allows designers the option to optimize density or minimize board layer count. XCede® HD is a small form factor system with a modular design for significant space savings and flexibility.
XCede® HDXCede® HD High-Density Backplane Connector System
Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions.
Small form factor provides significant space savings
Modular design provides flexibility in applications
High-density backplane system – up to 84 differential pairs per linear inch
1.80 mm column pitch
3-, 4- and 6-pair designs
4, 6 or 8 columns
12 - 48 pairs
Multiple signal/ground pin staging options
Integrated power, guidance, keying and side walls available
85 Ω and 100 Ω options
Three levels of sequencing enable hot plugging
Cost-effective designs available for low-speed applications
XCede® HD 1.80 mm Right-Angle Backplane Receptacle
XCede® HD 1.80 mm Vertical Backplane Header
3.20 mm XCede® HD Power Module
ExaMAX®ExaMAX® High-Speed Backplane Connector System
A key component of any high-speed signal path is the interconnect. Design engineers must identify the right connector (or connectors) and the best performance for the application. At 56 Gbps PAM4 data rates (and higher), connector selection becomes more challenging. Interconnect...
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Demand For High Data Rate As the need for bandwidth continues to increase, so does the need for higher data rates within a system. What was once one to three Gbps, then moved to 4 to 8 Gbps, and now we are approaching 28 Gbps and looking forward to 56 G. This trend was recently [...