Technology Centers

Technology Centers

Samtec Technology Centers are dedicated to developing and advancing technologies, strategies and products to optimize both the performance and cost of a system. These complementary, cross-functional groups leverage their respective areas of expertise and experience to ensure complete system optimization - from Silicon-to-Silicon™.

Signal Integrity Group

Signal Integrity Group

The Signal Integrity Group (SIG) provides in-house signal integrity expertise for complex applications, with live EE support available 24/7 worldwide. Services include full-channel analysis, high-data rate simulations, application-specific design and development assistance, and advanced design support.

High-Speed Cable Plant

High-Speed Cable Plant

This Technology Center focuses on R&D and manufacturing of precision extruded micro coax and twinax cable used for high-speed, high-density cable assemblies, including 26-38 AWG, 50/75/85/100 Ω impedance, and systems rated at 28 Gbps and beyond.

Samtec Optical Group

Samtec Microelectronics Group

The Microelectronics Group brings a unique blend of signal integrity and advanced IC packaging expertise to provide full channel system support. This includes precision die attach, fine pitch and low profile wire bond, flip chip, underfill and stacked die, com- plete IC-to-Board design, support and manufacturing of IC packaging, substrates, micro high-density inter- posers, and micro optical engines.

Samtec Optical Group

Samtec Optical Group

The Samtec Optical Group is an engineering team dedicated to the design, development, and application support of high performance micro optical engines, active optical assemblies, and high-density ganged passive optical panel solutions.

Advanced Interconnect Design

Advanced Interconnect Design

The Samtec Advanced Interconnect Design Technology Center (AID) ensures your interconnect systems are designed for quality, design flexibility, ease-of-processing, and even supply chain risk minimization. The AID includes precision stamping, plating, molding, and automated assembly for high-speed, fine pitch, array, and micro-rugged interconnects.

Samtec Teraspeed Consulting

Samtec Teraspeed Consulting

From the early stages of the design process including package design, material selection and PCB routing, through in-depth analysis, modeling and simulation, with measurement validation services available to 67 GHz, Samtec Teraspeed Consulting services can help you optimize and validate your high-performance systems. teraspeed.com

A myriad of mechanical and electrical specifications must be considered when selecting the best connector system for your design. An incomplete, first-pass list of considerations include the type of termination, available footprint space, processing and operating temperature and ...
Doing business today isn’t quite like it was back in the 80’s. Sparkling teeth and x-ray vision shouldn’t be a side effect of a customer using your product. This, of course, is said in jest, but no longer do we sell only a product; but a product and physical, chemical, and electr...
Blockchain. Cryptocurrencies. Bitcoin mining. Algorithmic trading. These disruptive technologies depend on high-performance computing platforms for reliable execution. The financial services industry invests billions in hardware to support the near real-time services consumers re...
Samtec has released the industry’s first 0.50 mm pitch edge card socket with justification beam. This design allows high-speed signals to pass through an incredibly dense connector while keeping the mating PCB at a reasonable cost. The socket’s justification beam is designed to s...
In the Standards world, specifications are categorized to three ascending levels: Corporate, De Facto, and Industry Standard. Corporate Standards are achieved when design elements are adopted company-wide. De Facto Standards often grow out of a Corporate Standard to act as a solu...
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